Electronic Polymers, Inc. Technology Overview

Problem Plaguing the Global Electronics Industry

Electrostatic discharge (ESD), which is the transfer of charge between bodies at different electrical potentials, can upset the normal operation of an electronic system and cause costly equipment failure. Over the last several decades, the negative economic impact of ESD on the global electronics industry has been growing at an accelerated rate as market demand for smaller size and higher performance has rendered prevalent electronic devices (e.g., cell phones, laptops, etc…) more sensitive to ESD. It is estimated that ESD today costs the global electronics industry nearly $90 billion a year.


Electrostatic discharges threaten to halt further shrinking and acceleration of electronic devices in the future”
-Steven H. Voldman IBM (holder of over 150 patents) in October 2002 Scientific American


EPI’s Solution and Market Opportunity

ESD is a problem relevant to every electronic device in the market today, and Electronic Polymers, Inc. (EPI) offers the only solution that fully addresses the ESD protection needs of sensitive cell phones, laptops, handhelds, and other devices we use every day. The solution is a breakthrough, patented technology called EPI-FLO, which is a polymerized material that detects, reacts to, and safely discharges ESD voltage spikes in picoseconds, before any damage to the protected device can occur. Since EPI-FLO is a flexible material that is easily form-factored to suit a variety of applications, EPI is in position to serve partners across the global electronics industry with products and licensed processes. Based on 2007 projections, EPI has the opportunity to address a total market that is worth over $300 billion 1. EPI’s primary and overarching focus is that of the mobile communications industry of which cell phones are projected to reach 1 Billion units in 2006.

 

 

 

 

 

 

 

 

EPI-FLO Products: EPI is currently focused on three core EPI-FLO products to meet immediate partner needs


�� EPI Connector Array ESD Suppressors
�� EPI Surface Mount ESD Suppressors
�� EPI-CORES Embedded in Semiconductor Packages
�� Future applications envisioned to utilize EPI-FLO in different form factors and markets:
�� EPI-FLO coated on semiconductor wafers
�� RFID, Smart Card (low profile) applications
�� Battery applications

 

 

 

 

 

EPI is focusing on riding the wave of the Mobile Communications/RF market (Cell phone, Smart Phone, etc.). This market is not only growing at an incredible rate, but it is also very susceptible to system-level ESD failures. The EPI-FLO solution fits this market perfectly due to both its electrical and mechanical characteristics:

�� Capacitance < 150 fF
�� Multiple line ESD protection
�� Bipolar
�� Low profile, ≤10 mils (0.25 mm)
�� Pico-second ESD response
�� Zero board space on a connector
�� Substrateless Surface Mount

 

 

 

 

 

 

 

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